D.K.R
3D X-ray solder test inspection.
Laminography Technology. C.L.=Laminography Reproduce only inspection target using X-ray shots less than 10.
21Sec* (25msec/cm2 or 4,000mm2/sec) The top of inspection speed in Off-line AOIs. 5 Mega Pixels High-Definition Telecentric Optical System.
72,000CPH (0.05sec/CHIP)
Excellent mounting capability Newly developed “Dual Stage Conveyor”. 34 kCPH/m2 Area-productivity, No.1* in the world!.
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