YSi-V 3D AOI
The new YSi-V model has been developed as a high-end model of the high-speed, high-precision, in-line type “YSi-12” AOI system equipped with optical, infrared and laser inspection functions and the same highly rigid frame as Yamaha surface mounters. To achieve higher levels of operating speed, the YSi-V features a newly developed 12 megapixel high-resolution camera, high-speed image processing technology, a new 3D inspection function that checks component height and tilt angle simultaneously, and a 4-direction angled camera*1 employing exclusive image capture technology, giving the YSi-V more than twice*2 the inspection capacity/performance of the YSi-12. At the same time, other new features such as a full-HD LCD touch panel, “programming navigation” and new character recognition algorithms improve operability.
*1 Includes some options. *2 YSi-12: approx. 5 megapixels; YSi-V: approx. 12 megapixels
The new YSi-V will be on display at the SMT Hybrid Packaging 2014 trade show for electronics manufacturing and surface mount technology (SMT) held from May 6 to 8 at Exhibition Centre in Nuremberg – Germany.
Market Background and Product Overview
The reliability of printed circuit boards (PCBs) is directly linked to the market value of the final product, and in the surface mounting industry where increasingly small components are being mounted with increasing density on today’s PCBs, manufacturers are seeking to ensure the reliability of the PCBs they produce by using automated inspection systems rather than depending on human inspection skills. These inspection systems must be capable of speedy and precise inspection of mounting precision and solder connections for quality control in the SMT production line. The new YSi-V has been developed as an in-line type AOI system with high-speed inspection performance compatible with use in dual-lane production and other forms of mass production lines, and with the reliability for detecting defective mounts with certainty and with an extremely low number of false defect reports.* Furthermore, the YSi-V offers new value for SMT production lines as it shares the same high-rigidity frames, control technology, image processing technology and SMT application concepts as our surfaces mounters, solder printers and inspection systems. As these products complement each other in use, the YSi-V fully employs the advantage of our position as a manufacturer of a full line of SMT equipment. One example of this advantage is integration of the communications systems of the surface mounter and the inspection system to enable realtime feedback of inspection results, thereby minimizing the occurrence of defective products, increasing the overall performance of the production line, and achieving smoother operation.
1) Greatly enhanced 2D inspection capability with the adoption of newly developed high-speed, high-resolution image processing technology
For the 2D external inspection that is the basic function of an AOI system, Yamaha leads the industry with the adoption of a 12 megapixel industrial-use camera and a newly designed telecentric lens to accommodate the higher number of pixels. In addition, the new model mounts a 64-bit high-speed image processing control system and more for increased computing capacity, and enables both a larger field of vision and greater detail and faster processing to achieve more than twice the inspection capacity/performance of the current YSi-12 model.
2) New 3D inspection function* that inspects component height and tilt angle in the field of vision simultaneously
The heights of components in the field of vision are measured simultaneously at high speed. With this, components above the proper height and defects that are difficult to detect with 2D image processing, such as when the coloring of the circuit board and the components are similar or when interference by silk screening or land patterns make foreign objects indiscernible, are quickly and precisely detected. In addition to component height, it is possible to inspect the degree of tilt, the direction the component faces, and accurately identify proper and improper forms.
3) Four-direction angle camera* supporting the visual inspection process to reduce human error and time loss
In addition to the camera angle from directly above the circuit board for 2D inspection, a camera using exclusive Yamaha image capture technology not only detects isolated defects but also inspects all of the components in the entire field of vision at once from four diagonal angles. This form of image inspection is equivalent to taking the PCB in hand and turning it to inspect it from four different directions, and means that a full visual (optical) inspection is possible without removing the PCB from the production line. It also helps prevent human errors from handling the PCB manually and reduces the number of operations on the line.
*Available as an option.
4) Accommodates larger PCB sizes and Dual Lane
In order to save space on the production line and heighten productivity, the YSi-V comes in a choice of two specifications: a single lane production spec capable of handling large PCBs up to L610 mm×W560 mm, and a dual lane spec handling PCBs up to L610 mm×W280 mm in dual lane use, and L610 mm×W510 mm in single lane use. Both of these specs can be equipped with optional equipment to handle long type PCBs of up to L750 mm.
5) Improved operability
Operability has been improved with the adoption of a number of new features and functions. These include a full-HD LCD touch panel that functions similar to a tablet device with motions like pinch-to-zoom and flick-to-scroll, etc., a “programming navigation” function that enables even beginners to create inspection data simply by following the directions provided by the navigation program and new character recognition algorithms that employ exclusively developed optical character verification (OCV) technology, and represent a further development of Yamaha’s well-received character recognition function.
|Applicable PCB:||L50 mm×W50 mm (min.) to L610 mm×W560 mm (max.) (in single-lane spec) *L750 mm long type PCB compatible (option)|
|Resolution:||Optical light (RGB) & infrared light: 12 μm / 7 μm (selectable)|
|Target items:||Condition of components after mounting Condition of solder and components after hardening|
|Power supply:||3-phase AC200/208/220/230/240/400/416V ±10% 50/60 Hz|
|Air supply source:||0.4 MPa or higher in clean, dry states|
|External dimensions:||L1,252×W1,497×H1,550 mm (excluding protrusions)|
|Weight:||Approx. 1,300 kg|