XT-2 Manual X-ray analyser
Mobile x-ray system series, ideal for prototyping, failure analysis, manufacturing process validation, rework verification and more. Solder quality verification and defect detection systems designed for fast and intuitive BGA/SMT solder quality inspection applications from entry-level to high-resolution and high-magnification setups.
System features
- X-ray source: 75 -90kV
- Magnification: >100X – >650X
- Spot size: 50-5 micron
- Resolution: >20 – 40 lp/mm
- Max. Field of View: 40 – 70mm
Applications
- Solder Joint Quality (BGA, Leaded)
- Bridging
- Voiding
- Opens
- Bare boards (Inner layers, traces, vias)
- Component Package Inspection (wire bonds)
- Subtle Defect Inspection